Enabling Short-Term Over-current Capability of SiC Devices using Microchannel Cooling
Author:
Affiliation:
1. KTH Royal Institute of Technology,Department of Electrical Engineering,Stockholm,Sweden
Funder
Hitachi
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10325669/10325677/10325880.pdf?arnumber=10325880
Reference19 articles.
1. Numerical optimization of the thermal performance of a microchannel heat sink
2. Design and Optimization of Single-Phase Liquid Cooled Microchannel Heat Sink
3. Investigation of the surge current capability of the body diode of SiC MOSFETs for HVDC applications
4. A Power Module for Grid Inverter With In-Built Short-Circuit Fault Current Capability
5. A manifold microchannel heat sink for ultra-high power density liquid-cooled converters
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Comparison of Short-Term Over-current Capability of SiC Devices using Microchannel Cooling below and on top of the Chip;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
2. Over-Current Capability of Silicon Carbide and Silicon Devices for Short Power Pulses with Copper and Phase Change Materials below the Chip;Energies;2024-01-17
3. Comparison of Top and Bottom Cooling for Short Duration of Over-Currents for SiC Devices: An Analysis of the Quantity and Location of Heat-Absorbing Materials;IEEE Open Journal of Power Electronics;2024
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