Chip Scale 12-Channel 10 Gb/s Optical Transmitter and Receiver Subassemblies Based on Wet Etched Silicon Interposer-Reference-Cited by-同舟云学术

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Chip Scale 12-Channel 10 Gb/s Optical Transmitter and Receiver Subassemblies Based on Wet Etched Silicon Interposer

Published:2017-08-01 Issue:15 Volume:35 Page:3229-3236
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Li Chenhui,Li Teng,Guelbenzu Gonzalo,Smalbrugge Barry,Stabile Ripalta,Raz Oded

Funder

FP7-COSIGN

STW project-an

CMOS Ethernet switch IC

VIDAP project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/50/7970202/07875398.pdf?arnumber=7875398

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Integrated Terahertz Beamforming System Based on Micromachined Silicon Interposer;2023 International Topical Meeting on Microwave Photonics (MWP);2023-10-15

2. A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes;IEEE Journal of Solid-State Circuits;2023-03

3. Compact OWC Receiver Enabled by Co-integration of Micro-Lens and PD Arrays on Glass Interposer;2022 IEEE International Topical Meeting on Microwave Photonics (MWP);2022-10

4. Co-Packaged Optics With Multimode Fiber Interface Employing 2-D VCSEL Matrix;Journal of Lightwave Technology;2022-05-15

5. Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-05

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