Characteristic Impedance Analysis and 2X-Thru De-embedding of Fine Line
Author:
Affiliation:
1. Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10275796/10276388/10276713.pdf?arnumber=10276713
Reference6 articles.
1. Calibrating an Arbitrary Test Fixture for a Symmetric Device by Three Measurements
2. High-density silicon carrier transmission line design for chip-to-chip interconnects
3. Using a 2x‐thru standard to achieve accurate de‐embedding of measurements
4. Measurements of characteristic impedance of high frequency cables with time domain reflectometry (TDR)
5. High impedance design and investigation using TDR for fine lines on high density organic substrate
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