Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform
Author:
Affiliation:
1. Fraunhofer IZM,Wafer Level System Integration,Berlin,Germany
2. Pactech GmbH,R&D,Nauen,Germany
3. Sentronics metrology GmbH,Sensor Development,Mannheim,Germany
4. Technical University Berlin,Berlin,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9229482/9229650/09229834.pdf?arnumber=9229834
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