Investigation of the impact of thermal aging of molding compounds on the solder joint fatigue of a VQFN package-Reference-Cited by-同舟云学术

Investigation of the impact of thermal aging of molding compounds on the solder joint fatigue of a VQFN package

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Zhang Maofen¹,Chan Yuen Sing¹,Richard Niessner Martin¹,Gerhard Schuetz¹,Paola Altieri-Weimar¹,Wunderle Bernhard²

Affiliation:

1. Infineon Technologies AG,Germany

2. TU Chemnitz,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758841.pdf?arnumber=9758841

Reference15 articles.

1. Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

2. Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

3. Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption;zhang;18th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,2017

4. Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

5. The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder

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1. Arrhenius Fatigue Life Modeling for Lead-Free Solder Joints in Accelerated Combined Fatigue and Creep Tests at Different Operating Temperatures;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

2. Reliability along the Value Chain – from Chip to Board/System;2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM);2022-10-23