Author:
Bornoff Robin,Farkas Gabor,Gaal Lajos,Rencz Marta,Poppe Andras
Cited by
10 articles.
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1. Packaging design and thermal analysis for 1 mm2 high power VCSEL;Microelectronics International;2022-07-15
2. On the Accuracy and Repeatability of Thermal Transient Measurements;Theory and Practice of Thermal Transient Testing of Electronic Components;2022
3. The Use of Thermal Transient Testing;Theory and Practice of Thermal Transient Testing of Electronic Components;2022
4. Thermal Transient Measurements on Various Electronic Components;Theory and Practice of Thermal Transient Testing of Electronic Components;2022
5. Thermal Metrics;Theory and Practice of Thermal Transient Testing of Electronic Components;2022