A Novel High-Temperature Planar Package for SiC Multi-Chip Phase-Leg Power Module

Author:

Ning Puqi,Lei Thomas G.,Wang Fred,Lu Guo-Quan,Ngo Khai D. T.

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Reliable Packaging Design for 1200-V, 500-A SiC Half-bridge Modules with Junction Temperature over 200 °C;2023 IEEE 6th International Electrical and Energy Conference (CIEEC);2023-05-12

2. The Packaging Design for a SiC MOSFET Power Module with High-Temperature Characteristics;2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC);2022-11-04

3. A Novel Hybrid Packaging Structure for High-Temperature SiC Power Modules;IEEE Transactions on Industry Applications;2013-07

4. A High-Temperature SiC Three-Phase AC–DC Converter Design for >$100 ^{\circ}$C Ambient Temperature;IEEE Transactions on Power Electronics;2013-01

5. Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-04

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