Performance Optimization of FBAR Filters with Wafer-Level Chip-Scale Package Using Embedded Matching Inductors on Multilayer PCB
Author:
Affiliation:
1. Sichuan Institute of Piezoelectric and Acousto-Optic Technology,Chongqing,China,400060
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10106786/10106791/10106859.pdf?arnumber=10106859
Reference9 articles.
1. High-Q FBAR filters in a wafer-level chip-scale package
2. Simulation Modeling and Analysis of FBAR RF Filters Considering Different Configurations of Grounding Bond-wires
3. High-Performance Surface Acoustic Wave Devices Using LiNbO3/SiO2/SiC Multilayered Substrates
4. A Hybrid Film-Bulk-Acoustic-Resonator/Coupled-Line/Transmission-Line High Selectivity Wideband Bandpass FBAR Filter
5. A novel architecture of a tunable bandpass BAW-filter for a WCDMA transceiver
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