A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging-Reference-Cited by-同舟云学术

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A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Song Jiaqi¹,Hu Shizun¹,Liu Yu¹,Ge Anxu¹,Zhang Donglin¹,Zhao Xiuchen¹,Huo Yongjun¹

Affiliation:

1. Beijing Institute of Technology,School of Materials Science&Engineering,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873195.pdf?arnumber=9873195

Reference14 articles.

1. High-Temperature BiScO3-PbTiO3Piezoelectric Vibration Energy Harvester

2. Effect of temperature on the main piezoelectric parameters of a soft PZT ceramic;miclea;Romanian Journal of Information Science and Technology,2007

3. Mid-infrared HgTe colloidal quantum dot photodetectors

4. Glass Frit as a Hermetic Joining Layer in Laser Based Joining of Miniature Devices

5. A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics Packaging

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Phase Equilibria of the Binary Ag-In System;Journal of Phase Equilibria and Diffusion;2024-07-17

2. A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-02

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