Novel 3-D structures [ICs]-Reference-Cited by-同舟云学术

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Novel 3-D structures [ICs]

Published: Issue: Volume: Page:
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Container-title:1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)
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Author:

Saraswat K.C.,Souri S.J.,Subramanian V.,Joshi A.R.,Wang A.W.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6647/17747/00819855.pdf?arnumber=819855

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sub-nanometer heating depth of atomic layer annealing;Applied Surface Science;2020-09

2. Performance Investigation of Single Grain Boundary Junctionless Field Effect Transistor;IEEE Journal of the Electron Devices Society;2016-11

3. Monolithic 3D Integrated Circuits;Integrated Circuits and Systems;2008

4. Low-temperature LPCVD of Si nanocrystals from disilane and trisilane (Silcore®) embedded in ALD-alumina for non-volatile memory devices;Surface and Coatings Technology;2007-09

5. Stacked 3-D Fin-CMOS technology;IEEE Electron Device Letters;2005-06

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