Author:
Sinclair K. I.,Tilford T.,Desmulliez M. Y. P.,Goussetis G.,Bailey C.,Parrott K.,Sangster A. J.
Cited by
1 articles.
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1. Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-05