Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling-Reference-Cited by-同舟云学术

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Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Author:

Che Fa Xing,Yamamoto Kazunori,Tang Gong Yue,Ji Lin

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026668.pdf?arnumber=9026668

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical Design and Modeling of Silicon Carbide Power Modules for Inverter Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Mechanical simulation and modeling for reliability of 6-in-1 power module;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

4. Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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