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A New Frontier in Ultralow Power Wireless Links: Network-on-Chip and Chip-to-Chip Interconnects

  • Published:2015-02 Issue:2 Volume:34 Page:186-198
  • ISSN:0278-0070
  • Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • language:
  • Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Laha Soumyasanta,Kaya Savas,Matolak David W.,Rayess William,DiTomaso Dominic,Kodi Avinash

Funder

NSF

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 56 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Systematic Physics-Compliant Analysis of Over-the-Air Channel Equalization in RIS-Parametrized Wireless Networks-on-Chip;IEEE Journal on Selected Areas in Communications;2024-08

2. An Omnidirectional Antenna-in-Package Based on FOWLP for THz Chip-to-Chip Wireless Interconnect Applications;2024 15th Global Symposium on Millimeter-Waves & Terahertz (GSMM);2024-05-20

3. On the Data Rate Capability of Near-Field Communications Links based on Bessel Beams;2024 18th European Conference on Antennas and Propagation (EuCAP);2024-03-17

4. Evaluating NoC and WiNoC Architectures for Multicore Architecture Performance;2024 International Conference on Green Energy, Computing and Sustainable Technology (GECOST);2024-01-17

5. Performance and Energy Evaluation of Dynamic Adaptive Deterministic Routing for Multicore Architectures;2024
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