An analytical model of the RF impedance change due to solder joint cracking-Reference-Cited by-同舟云学术

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An analytical model of the RF impedance change due to solder joint cracking

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI)
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Author:

Azarian Michael H.,Lando Emile,Pecht Michael

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5873181/5898824/05898847.pdf?arnumber=5898847

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