Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging-Reference-Cited by-同舟云学术

Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging

Published:2022-11 Issue:11 Volume:32 Page:1367-1370
ISSN:1531-1309
Container-title:IEEE Microwave and Wireless Components Letters
language:
Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Tian Jun¹^ORCID,Teng Yucheng¹,Li Ruining¹,Zhou Yijiang¹,Zhang Daxing²,Liu Shaoyi¹,Xue Song¹,Lin Kabin³^ORCID,Wang Meng⁴^ORCID,Leng Guojun⁵^ORCID,Wang Congsi¹^ORCID

Affiliation:

1. Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China

2. Guangzhou Institute of Technology, Xidian University, Guangzhou, China

3. Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, and the School of Mechano-Electronic Engineering, Xidian University, Xi’an, China

4. Research Institute of Shaanxi Huanghe Group Company Ltd., Xi’an, China

5. 29th Research Institute of China Electronics Technology Group Corporation, Chengdu, China

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Youth Innovation Team of Shaanxi Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Link

http://xplorestaging.ieee.org/ielx7/7260/9941011/09795184.pdf?arnumber=9795184

Reference18 articles.

1. Electromechanical Coupling Parameter Identification for Flexible Conductor Wire Interconnection Considering Interaction Effect in Microwave Circuits

2. Modeling and characterization of the bonding-wire interconnection

3. Foundations for Microstrip Circuit Design

4. Simple and accurate formulas for a microstrip with finite strip thickness

5. A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration