Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning
Author:
Affiliation:
1. Hamburg University of Technology (TUHH),Institut für Theoretische Elektrotechnik,Hamburg,Germany
2. Celestica Inc.,Ottawa,ON,Canada
3. Cisco Inc.,San Jose,CA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9874829/9874923/09874946.pdf?arnumber=9874946
Reference15 articles.
1. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
2. Efficient Crosstalk Analysis of Differential Links on Printed Circuit Boards Up to 100 GHz
3. Special Session on Power Integrity Techniques: Contour Integral Method for Rapid Computation of Power/Ground Plane Impedance;duan,2010
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