The design and testing of the super fiber heat pipes for electronics cooling applications-Reference-Cited by-同舟云学术

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The design and testing of the super fiber heat pipes for electronics cooling applications

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Container-title:Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)
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Author:

Sauciuc I.,Mochizuki M.,Mashiko K.,Saito Y.,Nguyen T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6765/18078/00837058.pdf?arnumber=837058

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of spontaneous capillary flow and heat transfer characteristics in parallel microchannels based on phase-field model;Thermal Science and Engineering Progress;2022-12

2. Experimental Study on the Heat Transfer Performance of a Stainless-Steel Heat Pipe With Sintered Fiber Wick;Journal of Thermal Science and Engineering Applications;2021-11-18

3. An Experimental Investigation on Thermal Performance of Ultra-Thin Heat Pipes with Superhydrophilic Copper Braids;Heat Transfer Engineering;2020-03-29

4. Experimental study on the capillary performance of aluminum micro-grooved wicks with reentrant cavity array;International Journal of Heat and Mass Transfer;2019-08

5. Experimental study of small diameter fibres as wick material for capillary-driven heat pipes;Applied Thermal Engineering;2015-03

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