Ultrasonic-accelerated TLPB with Ga-Cu Paste Solder for Low-temperature Electronics Interconnects
Author:
Affiliation:
1. Loughborough University,Wolfson School of Mechanical and Manufacturing Engineering,Leicestershire,UK
2. Loughborough University,Loughborough Materials Characterisation Center,Leicestershire,UK
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492374.pdf?arnumber=10492374
Reference18 articles.
1. Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles
2. Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications
3. Transient liquid phase bonding
4. Transient Liquid Phase Bonding
5. Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound
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