Research on Structure Reliability Design Technology of High Power Ceramic Based Microsystem package
Author:
Affiliation:
1. CETC,The 13th Research Institute,Shijiazhuang,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492429.pdf?arnumber=10492429
Reference7 articles.
1. Simulation-Based Impedance Characterization of PDN in High-Performance Multi-Chip HTCC Packages for Avionics
2. High‐performance bandpass filter using HTCC stepped‐impedance resonators
3. Heat dissipation based on LTCC-HTCC heterostructure
4. Ultra low-profile self-matched HTCC SAW-duplexer: manufacturing and performance challenges
5. Hybrid-cascaded modeling strategy for 28Gbps high-speed transceivers in high-density FPGA packages
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