An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging
Author:
Affiliation:
1. Beijing University of Technology,Materials and Manufacturing Department,Beijing,China
Funder
National Natural Science Foundation of China
Beijing Municipal Education Commission
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492337.pdf?arnumber=10492337
Reference9 articles.
1. Reliability of MEMS: A perspective on failure mechanisms, improvement solutions and best practices at development level
2. The Analysis of the Structural Dynamic Characteristics in Board Packaging Structure and Its Test Technology Research
3. Thermal modeling of diamond-based power electronics packaging
4. An effective and efficient numerical method for thermal management in 3D stacked integrated circuits
5. Three-Dimensional Thermal Stress Analysis under Steady State with Heat Generation by Boundary Element Method
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