Stress-strain analysis and optimization of laminated solder joints under random vibration load based on Taguchi and grey correlation method-Reference-Cited by-同舟云学术

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Stress-strain analysis and optimization of laminated solder joints under random vibration load based on Taguchi and grey correlation method

Published:2023-08-08 Issue: Volume:23 Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Wu Liye¹,Huang Chunyue¹,Liu Xiaobin¹,Wang Lilin¹,Liu Xianjia¹,Zhang Huaiquan¹

Affiliation:

1. Guilin University of Electronic Technology,School of Electronic Mechanical Engineering,Guilin,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492411.pdf?arnumber=10492411

Reference16 articles.

1. Review of microelectronic packaging technology and development trend [J];Xiaodan;Journal of Beihua Institute of Aerospace Technology,2013

2. Random vibration reliability analysis of laminated solder joints based on Patran and frequency domain analysis[J];Zhang;Vibration and Shock,2017

3. Progress in the study of solder joints reliability of board-level assemblies under random vibration[J];Liu;Electronic Components and Materials,2015

4. Vibration fatigue life prediction model for Flip Chip solder joints [J];Hongfang;Journal of Shanghai Jiaotong University,2001

5. Failure mechanism of Sn-Cu intermetallic compounds in BGA solder joints induced by sinusoidal vibration[J];Hu;Chinese Journal of Nonferrous Metals,2019

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