Life Prediction of Solder Interconnects under Harsh Thermal Cycling from Microstructural Degradation-Reference-Cited by-同舟云学术

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Life Prediction of Solder Interconnects under Harsh Thermal Cycling from Microstructural Degradation

Published:2023-08-08 Issue: Volume: Page:1-10
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Jiang Wanyu¹,Xu Jingwen¹,Wang Jing¹,Hu Hao¹,Zhang Wei¹,An Rong²

Affiliation:

1. Harbin Institute of Technology,State Key Laboratory of Advanced Welding and Joining,Harbin,China

2. Manufacturing of Ministry of Education, School of Medicine and Health Harbin Institute of Technology,State Key Laboratory of Advanced Welding and Joining, Key Laboratory of Micro-Systems and Micro-Structures,Harbin,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492136.pdf?arnumber=10492136

Reference14 articles.

1. The International Handbook of Space Technology

2. Materials and Processes

3. Space environment testing of photovoltaic array systems at NASA's Marshall Space Flight Center

4. Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean

5. The effects of temperature and solders on the wettability between ribbon and solar cell

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