Three-point Bending Test Method Experimental Study for Package Strength and Crack Prediction through Finite Element Analysis
Author:
Affiliation:
1. Samsung Semiconductor(China)R&D CO., LTD,Packaging Technology Development Team,Suzhou,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492178.pdf?arnumber=10492178
Reference6 articles.
1. Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects
2. Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation
3. Evaluation of Fan-out Wafer Level Package strength by three-point bending testing
4. Mechanical Suite of Flexural Bending Method for Electronic Memory Packages
5. An improved three-point bending test method for the investigation of nanosecond laser dicing of ultrathin Si dies with Cu stabilization layer
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