Multiplexing Schemes for sub-THz/THz Interconnects (Invited)
Author:
Affiliation:
1. University of California Davis,Department of Electric and Computer Engineering,Davis,CA,USA,95616
Funder
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9882303/9882341/09882455.pdf?arnumber=9882455
Reference6 articles.
1. Making spatial multiplexing a reality
2. THz interconnect for inter-/intra-chip communication
3. Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications
4. An FDD-based Full-Duplex Sub-THz Interconnect with Data-rate of 22.6 Gb/s and Energy-Efficiency of 1.58pJ/bit
5. Sub-THz/THz Interconnect, Complement to Electrical and Optical Interconnects: Addressing Fundamental Challenges Related to Communication Distances
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect;IEEE Transactions on Microwave Theory and Techniques;2024-01
2. A 1.6pJ/b 65Gb/s Si-Dielectric-Waveguide based Multi-Mode Multi-Drop sub-THz Interconnect in 65nm CMOS;2023 IEEE Custom Integrated Circuits Conference (CICC);2023-04
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