Flexible Hybrid Electronics: Review and Challenges-Reference-Cited by-同舟云学术

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Flexible Hybrid Electronics: Review and Challenges

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE International Symposium on Circuits and Systems (ISCAS)
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Author:

Tong Ge,Jia Zhou,Chang Joseph

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8334884/8350884/08351806.pdf?arnumber=8351806

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser sintering of various film compositions used in flexible hybrid electronics;Laser-based Micro- and Nanoprocessing XVIII;2024-03-12

2. Flexible MEMS-IC Microsystem by a Wafer-Level F-eSiFO Integration Process;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21

3. Design for EMI Immunity and ESD Protection for Wearable and Flexible ICs (Invited);2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

4. Broadband Electromagnetic Properties of Engineered Flexible Absorber Materials;Advanced Materials Technologies;2023-08-23

5. Strain Isolation for Flexible-to-Stretchable Electrical Interconnects;2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2023-07-09

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