A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/10951/34490/01645802.pdf?arnumber=1645802
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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3. Lead-Free Soldering;Materials for Advanced Packaging;2016-11-19
4. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products;Microelectronics Reliability;2012-01
5. On the effects of temperature on the drop reliability of electronic component boards;Microelectronics Reliability;2012-01
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