Author:
Mori Kentaro,Ohshima Daisuke,Sasaki Hideki,Fujimura Yuki,Kikuchi Katsumi,Nakashima Yoshiki,Funaya Takuo,Nishiyama Tomohiro,Murakami Tomoo,Yamamichi Shintaro
Cited by
3 articles.
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1. Electroplated Copper for Heterogeneous Die Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-07
2. Reliability of thin seamless package with embedded high-pin-count LSI chip;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010
3. Warpage Mechanism of Thin Embedded LSI Packages;Transactions of The Japan Institute of Electronics Packaging;2010