Author:
Darveaux Robert,Reichman Corey
Cited by
25 articles.
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1. The effect of low temperature conditions on vibration durability of SAC105 interconnects;Microelectronics Reliability;2021-07
2. Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
3. Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics;Scientific Reports;2020-09-09
4. Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-07
5. The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07