Mitigating the Effects of Au-Al Intermetallic Compounds Due to High-Temperature Processing of Surface-Electrode Ion Traps-Reference-Cited by-同舟云学术

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Mitigating the Effects of Au-Al Intermetallic Compounds Due to High-Temperature Processing of Surface-Electrode Ion Traps

Published:2024-07 Issue:7 Volume:14 Page:1141-1148
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Haltli Raymond A.¹^ORCID,Ou Eric¹,Nordquist Christopher D.¹^ORCID,Clark Susan M.¹^ORCID,Revelle Melissa C.¹

Affiliation:

1. Microsystems Engineering Science and Application (MESA) Center, Sandia National Laboratories, Albuquerque, NM, USA

Funder

Advanced Scientific Computing Research

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

https://ieeexplore.ieee.org/ielam/5503870/10638331/10570227-aam.pdf

Reference33 articles.

1. A review of silicon microfabricated ion traps for quantum information processing

2. Assembling a Ring-Shaped Crystal in a Microfabricated Surface Ion Trap

3. High Optical Access Trap 2.0.

4. Phoenix and Peregrine ion traps;Revelle;arXiv:2009.02398

5. Hybrid MEMS-CMOS ion traps for NISQ computing

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