A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application
Author:
Affiliation:
1. Department of Electrical Engineering and the Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan
2. Zhen Ding Technology Group, Taoyuan, Taiwan
Funder
Zhen Ding Technology
Qualcomm through a Taiwan University Research Collaboration Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/10287668/10239436.pdf?arnumber=10239436
Reference13 articles.
1. Wideband air‐filled ridge substrate‐integrated waveguide
2. Eigenvalue Spectrum of Rectangular Waveguide with Two Symmetrically Placed Double Ridges
3. On the Complete Eigenvalue Solution of Ridged Waveguide
4. A mm-Wave Low-Loss Transition from Microstrip Line to Air-Filled Substrate Integrated Wavguide on Printed Circuit Board Technology
5. Reduction of dielectric losses in substrate integrated waveguide
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