Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System-Reference-Cited by-同舟云学术

Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System

Published:2019-01 Issue:1 Volume:9 Page:173-180
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Adamietz Raphael¹^ORCID,Desmulliez Marc P. Y.²^ORCID,Pavuluri Sumanth Kumar²,Tilford Tim³,Bailey Chris³,Schreier-Alt Thomas⁴,Warmuth Jens⁵

Affiliation:

1. Fraunhofer Institute for Manufacturing Engineering and Automation, Stuttgart, Germany

2. Research Institute of Sensors, Signals and Systems, Heriot-Watt University, Edinburgh, U.K.

3. Department of Mathematical Sciences, University of Greenwich, London, U.K.

4. Hochschule Ravensburg-Weingarten, Württemberg, Germany

5. Engineering of Adaptive Systems Division, Fraunhofer Institute for Integrated Circuits, Dresden, Germany

Funder

FP7 Nanosciences, Nanotechnologies, Materials and new Production Technologies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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