In-Place Evaluation of Powering and Signaling Within Fan-Out Multiple IC Chip Packaging-Reference-Cited by-同舟云学术

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In-Place Evaluation of Powering and Signaling Within Fan-Out Multiple IC Chip Packaging

Published:2022-07 Issue:7 Volume:12 Page:1140-1149
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Sonoda Hiroki¹^ORCID,Kasai Ryo²,Tanaka Daisuke²,Murakami Yoshihide²,Mihara Kyoshi²,Araga Yuuki³^ORCID,Watanabe Naoya³^ORCID,Shimamoto Haruo³^ORCID,Kikuchi Katsuya³^ORCID,Miki Takuji¹^ORCID,Nagata Makoto¹^ORCID

Affiliation:

1. Graduate School of Science, Technology and Innovation, Kobe University, Kobe, Japan

2. Murata Manufacturing Company Ltd., Kyoto, Japan

3. National Institute of Advanced Industrial Science and Technology (AIST), AIST Tsukuba Headquarters, Ibaraki, Tsukuba, Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9841047/09785626.pdf?arnumber=9785626

Reference33 articles.

1. Susceptibility evaluation of CAN transceiver circuits with in-place waveform capturing under RF DPI

2. Noise analysis using on-chip waveform monitor in bandgap voltage references

3. An On-Chip Waveform Capturer and Application to Diagnosis of Power Delivery in SoC Integration

4. An On-Chip Multichannel Waveform Monitor for Diagnosis of Systems-on-a-Chip Integration

5. Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies

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