Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages-Reference-Cited by-同舟云学术

Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages

Published:2022-09 Issue:9 Volume:12 Page:1492-1501
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ismail Adlil Aizat¹^ORCID,Abu Bakar Maria²^ORCID,Ehsan Abang Annuar²,Jalar Azman³^ORCID,Basiron Erwan¹,Ani Fakhrozi Che¹

Affiliation:

1. Western Digital, SanDisk Storage Malaysia Sdn. Bhd., Batu Kawan, Malaysia

2. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Malaysia

3. Institute of Microengineering and Nanoelectronics and the Department of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, Bangi, Malaysia

Funder

Western Digital via SanDisk Storage Malaysia Sdn. Bhd and Universiti Kebangsaan Malaysia

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9913798/09855523.pdf?arnumber=9855523

Reference28 articles.

1. Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling

2. Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage

3. Warpage measurement of substrates and printed circuit boards with shadow Moiré;huang;Proc Int Conf Electron Packag Technol (ICEPT),2021

4. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

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5. Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering;Springer Proceedings in Physics;2023