Moisture Diffusion Inside the BEOL of an FC-PBGA Package-Reference-Cited by-同舟云学术

Moisture Diffusion Inside the BEOL of an FC-PBGA Package

Published:2022-11 Issue:11 Volume:12 Page:1740-1747
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Vandier Quentin¹^ORCID,Fremont Helene²^ORCID,Drouin Dominique¹^ORCID

Affiliation:

1. Institut Interdisciplinaire d’Innovation Technologique (3IT), and the Nanotechnologies and Nanosystems Laboratory (LN2), CNRS UMI-3463, Universite de Sherbrooke, Sherbrooke, Canada

2. Laboratoire de l’Intégration du Matériau au Système, CNRS UMR 5218, Universite de Bordeaux, Talence, France

Funder

Natural Sciences and Engineering Research Council of Canada (NSERC) /IBM Industrial Research Chair in High-Performance Heterogeneous Integration

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9999035/09967983.pdf?arnumber=9967983

Reference26 articles.

1. Experimental investigations and model study of moisture behaviors in polymeric materials

2. Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package

3. Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

4. Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

5. Study on moisture behavior in flip chip BGA packages and bake process optimization

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