A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films
-
Published:2020-01
Issue:1
Volume:10
Page:176-183
-
ISSN:2156-3950
-
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
-
language:
-
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Jung Seung-Yoon,
Oh Seung JinORCID,
Lee Tae-Ik,
Kim Taek-SooORCID,
Paik Kyung-WookORCID
Funder
Wearable Platform Materials Technology Center
National Research Foundation of Korea
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials