Untangling the Mysteries of Plated Metal Finger Adhesion: Understanding the Contributions From Plating Rate, Chemistry, Grid Geometry, and Sintering-Reference-Cited by-同舟云学术

Untangling the Mysteries of Plated Metal Finger Adhesion: Understanding the Contributions From Plating Rate, Chemistry, Grid Geometry, and Sintering

Published:2016-09 Issue:5 Volume:6 Page:1167-1174
ISSN:2156-3381
Container-title:IEEE Journal of Photovoltaics
language:
Short-container-title:IEEE J. Photovoltaics

Author:

Wang Xi¹,Hsiao Pei-Chieh¹,Zhang Wei¹,Johnston Ben²,Stokes Alex²,Wei Qilong³,Fell Andreas⁴,Surve Sachin⁵,Shengzhao Yuan⁶,Verlinden Pierre⁶,Lennon Alison¹

Affiliation:

1. School of Photovoltaics and Renewable Energy Engineering, University of New South Wales, Sydney, NSW, Australia

2. Department of Physics, Macquarie University, North Ryde, NSW, Australia

3. Institute of Machinery Manufacturing Technology, Chinese Academy of Engineering Physics, Mianyang, China

4. Fraunhofer Institute for Solar Energy Systems, Freiburg, Germany

5. College of Engineering and Computer Science, Australian National University, Canberra, ACT, Australia

6. State Key Lab of PV Science and Technology, Trina Solar Limited, Changzhou, China

Funder

Australian Government

Australian Renewable Energy Agency

Australian research and development in solar photovoltaic and solar thermal technologies to help solar power become cost competitive with other energy sources

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503869/7547334/07536136.pdf?arnumber=7536136

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