Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality-Reference-Cited by-同舟云学术

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Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality

Published:2018-09 Issue: Volume: Page:
ISSN:
Container-title:2018 7th Electronic System-Integration Technology Conference (ESTC)
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Author:

Bickel Steffen,Sen Shawon,Meyer Jorg,Panchenko Iuliana,Wolf M. Jurgen

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8520538/8546331/08546413.pdf?arnumber=8546413

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate;Materials;2023-09-18

2. Investigation of the Stability of CuIn₂ in Cu-In Phase Diagram;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

3. Phase characterization of interfacial reactions in the Ni/In/Cu ternary system;Journal of Materials Science: Materials in Electronics;2021-01-08

4. Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition;Materials Letters;2020-01

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