Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
17 articles.
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1. Performance Analysis of 3D Stacked Memory Architectures in High Performance Computing;2024 4th International Conference on Advance Computing and Innovative Technologies in Engineering (ICACITE);2024-05-14
2. Silicate-Based Packaging Materials for Heterogeneous Integration of Microsystems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
3. MC-ELMM: Multi-Chip Endurance-Limited Memory Management;Proceedings of the International Symposium on Memory Systems;2023-10-02
4. A Survey Describing Beyond Si Transistors and Exploring Their Implications for Future Processors;ACM Journal on Emerging Technologies in Computing Systems;2021-06-25
5. Review on VLSI design using optimization and self-adaptive particle swarm optimization;Journal of King Saud University - Computer and Information Sciences;2020-12