Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages-Reference-Cited by-同舟云学术

Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages

Published:2022-09-13 Issue: Volume: Page:
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Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Yin Ran¹,Nieweglowski Krzysztof¹,Meier Karsten²,Bock Karlheinz¹

Affiliation:

1. Centre for Tactile Internet with Human-in-the-Loop (CeTI), Technische Universität Dresden,Institute of Electronic Packaging Technology,Department of Electrical and Computer Engineering,Germany

2. Technische Universität Dresden,Institute of Electronic Packaging Technology,Department of Electrical and Computer Engineering,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939532.pdf?arnumber=9939532

Reference8 articles.

1. Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips

2. Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?

3. Flexible and stretchable redistribution layer with embedded chips for human-machine interface

4. Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests

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