Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan Out Panel Level Packaging (FOPLP)-Reference-Cited by-同舟云学术

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Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan Out Panel Level Packaging (FOPLP)

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lee Hyunju¹,Park Sung Keun¹,Jeong Kwangok¹,Jung Jaemok¹,Choi Ju-il¹,Kang Un-Byoung¹,Kim Kuyoung¹

Affiliation:

1. AVP Business Team Samsung Electronics Co., Ltd,Cheonan-si,Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195549.pdf?arnumber=10195549

Reference5 articles.

1. Depth-dependent self-annealing behavior of electroplated Cu

2. A Study of Substrate Models and Its Effect On Package Warpage Prediction

3. In-situ study on the self-annealing behavior of electroplated Cu through the cantilever method, XRD, and EBSD

4. Advanced Build-up Materials for High Speed Transmission Application

5. Influence of surface morphology on the adhesion strength of plated Cu on the build-up layer within an embedded active package

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Wafer Backside Fine 0.4 µm Pitch Copper Interconnects for Multi Stacked Device Integration;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

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