Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application-Reference-Cited by-同舟云学术

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Martin Henry¹,Reintjes Marcia²,Reijs Dave³,Dorrestein Sander³,Kengen Martien³,Libon Sebastien³,Smits Edsger³,Tang Xiao²,Koelink Marco³,Poelma Rene¹,van Driel Willem¹,Zhang GuoQi¹

Affiliation:

1. Delft University of Technology,Department of Microelectronics,2628 CD Delft,The Netherlands

2. Mintres B.V.,5431 NT Cuijk,The Netherlands

3. Chip Integration Technology Center (CITC),6534 AT Nijmegen,The Netherlands

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195627.pdf?arnumber=10195627

Reference23 articles.

1. Diamond-based heat spreaders for power electronic packaging applications;guillemet;ProQuest Dissertations And Theses Thesis (Ph D )-The University of Nebraska - Lincoln,2013

2. Properties of Bulk Sintered Silver As a Function of Porosity

3. Thermal Test Chip Design and Performance Considerations

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