Photonic system integration by applying microelectronic packaging approaches using glass substrates
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany,13355
2. TOPTICA eagleyard,Berlin,Germany,12489
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195718.pdf?arnumber=10195718
Reference19 articles.
1. High Aspect Ratio Through-Glass Vias as Heat Conductive Element;krohnert;2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),2022
2. Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform
3. Internal modification of glass by ultrashort laser pulse and its application to microwelding
4. High speed through glass via manufacturing technology for interposer
5. Through Glass Vias for hermetically sealed High Frequency Application
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1. Flexo-printed polymer waveguides for integration in electro-optical circuit boards;Flexible and Printed Electronics;2024-07-04
2. A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Photonic-System-in-package (pSiP): miniaturization, panel level assembly, and optical waveguide integration in thin glass substrates;Optical Interconnects XXIV;2024-03-11
4. Photonic System-in-Package (pSiP) by Applying Thin Glass;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15
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