Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications-Reference-Cited by-同舟云学术

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Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Wang Xinyue¹,Yang Zhoudong²,Zhang Guoqi³,Zhang Jing⁴,Liu Pan¹

Affiliation:

1. Academy for Engineering and Technology, Fudan University,Shanghai,China

2. Fudan University,Laboratory of Advanced Materials,Shanghai,China

3. Electronic Components, Technology, and Materials, Delft University of Technology,Delft,the Netherlands

4. Heraeus Materials Technology Shanghai Ltd,Shanghai,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195699.pdf?arnumber=10195699

Reference9 articles.

1. A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

2. Mechanical properties of sintered Ag–Cu die-attach nanopaste for application on SiC device

3. Correlations between the inhibition performances and the inhibitor structures of some azoles on the galvanic corrosion of copper coupled with silver in artificial seawater

4. Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

5. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

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1. Estimation of Corrosion of Iron Using Clustering Techniques;2024 Sixth International Conference on Computational Intelligence and Communication Technologies (CCICT);2024-04-19

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