Rapid Formation of High-Strength Sintered Silver Joints with High Reliability-Reference-Cited by-同舟云学术

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Rapid Formation of High-Strength Sintered Silver Joints with High Reliability

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Zhang Xu¹,Zhu Pengli¹,Zhao Tao¹,Xu Liang¹,Sun Rong¹

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Shenzhen Basic Research Programs

SIAT Outstanding Young Researchers Innovation Program

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195456.pdf?arnumber=10195456

Reference12 articles.

1. Joining of solid oxide fuel/electrolysis cells at low temperature: A novel method to obtain high strength seals already at 300 °C

2. Development of high-strength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization

3. Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles

4. Investigating the effect of brazing parameters on joint quality in DIN 2391 steel material and natural stone cutting core sockets joined by using induction brazing method

5. Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices

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