Solder Joint Fatigue Studies Subjected to Board-level Random Vibration for Automotive Applications-Reference-Cited by-同舟云学术

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Solder Joint Fatigue Studies Subjected to Board-level Random Vibration for Automotive Applications

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Khaldarov Valeriy¹,Zhang Andy²,Xie Dongji³,Lee Jeffrey⁴,Shi Xue⁵,Roucou Romuald⁶,Doranga Sushil⁷,Shalumov Alexander¹

Affiliation:

1. ASONIKA, LLC,Tempe,AZ

2. Texas Instruments,Dallas,TX

3. Nvidia Corporation,Santa Clara,CA

4. iST-Integrated Service Technology,Hsinchu,Taiwan, R.O.C.

5. Bosch Automotive Products,Suzhou,P.R.China

6. NXP Semiconductors,Nijmegen,The Netherlands

7. Lamar University,Beaumont,TX

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816399.pdf?arnumber=9816399

Reference24 articles.

1. Vibration-induced solder joint failure of a Ceramic Column Grid Array (CCGA) package

2. An efficient method for calculating RMS von Mises stress in a random vibration environment

3. A Tutorial on Design Analysis Using von Mises Stress in Random Vibration Environments

4. Vibration analysis for electronic equipment;steinberg,1988

5. Random vibration test for electronic assemblies;al-yafawi;Proc Itherm,2010

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration;Journal of Electronic Testing;2024-02

2. Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration;Journal of Electronic Testing;2024-02

3. New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-level Random Vibrations for Automotive Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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