Process and Design Optimization for Hybrid Cu Bonding Void
Author:
Affiliation:
1. Samsung Electronics Co. Ltd,Test & System Package,Cheonan-Si,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816392.pdf?arnumber=9816392
Reference5 articles.
1. Characterization of inorganic dielectric layers for low thermal budget wafer-to-wafer bonding
2. Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology
3. A novel role for SiCN to suppress H2O outgas from TEOS oxide films in hybrid bonding;ueda;2017 IEEE Electronic Component and Technol Conf,0
4. CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference
5. Process optimization of micro bump pitch design in 3-dimensional package structure
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1. A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature pre-Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
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