Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer-Reference-Cited by-同舟云学术

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Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Pantano Nicolas¹,Chery Emmanuel¹,De Beeck Maaike Op²,Slabberkoorn John¹,Beyne Eric¹

Affiliation:

1. Imec,Leuven,Belgium

2. Imec,Ghent,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816598.pdf?arnumber=9816598

Reference22 articles.

1. Photosensitive polymer reliability for fine pitch RDL applications

2. Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications

3. HAST failure investigation on ultra-high density lines for 2.1D packages

4. Higher reliability for low-temperature curable positive-tone photosensitive dielectric materials

5. Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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