Mechanical simulation and modeling for reliability of 6-in-1 power module-Reference-Cited by-同舟云学术

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Mechanical simulation and modeling for reliability of 6-in-1 power module

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Mandal Rathin¹,Yamamoto Kazunori¹,Tang Gongyue¹

Affiliation:

1. A*STAR (Agency for Science, Technology and Research),Institute of Microelectronics,Singapore

Funder

Science and Engineering Research Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816610.pdf?arnumber=9816610

Reference7 articles.

1. Thermal fatigue analysis of a CBGA package with lead-free solder fillets

2. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

3. Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

4. Reliability assessment of sintered nano-silver die attachment for power semiconductors

5. Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

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