Effect of Scandium Insertion Into the Gate-Stack of Ferroelectric Field-Effect Transistors
Author:
Affiliation:
1. School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea
2. Electronic Materials Research Center, Korea Institute of Science and Technology (KIST), Seoul, South Korea
Funder
NRF
BK21 FOUR, Korea Advanced Institute of Science and Technology for Processing In Memory
IC Design Education Center
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/10081247/10050415.pdf?arnumber=10050415
Reference28 articles.
1. Ferroelectric Si-Doped HfO2 Device Properties on Highly Doped Germanium
2. Improved TDDB Reliability and Interface States in 5-nm Hf0.5Zr0.5O2 Ferroelectric Technologies Using NH3 Plasma and Microwave Annealing
3. Gate Engineering in TiN/La/TiN and TiLaN Metal Layers on Atomic-Layer-Deposited $\hbox{HfO}_{2}/\hbox{Si}$
4. Enhanced Reliability of Ferroelectric HfZrO x on Semiconductor by Using Epitaxial SiGe as Substrate
5. Effects of Annealing on Ferroelectric Hafnium–Zirconium–Oxide-Based Transistor Technology
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