Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159286.pdf?arnumber=9159286
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Degradation Mechanisms of SiC MOSFET Power Module With Cu–Cu Die Top Interconnects Under Power Cycling Stress;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08
2. A study on the thermomechanical response of various die attach metallic materials of power electronics;Soldering & Surface Mount Technology;2024-05-09
3. Research on the creep response of lead-free die attachments in power electronics;International Journal of Structural Integrity;2024-05-07
4. Application of Machine Learning to Recognize Wire Bond Lift-Off in Power Electronics Manufacturing;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
5. Observation of PWM-Dependent Chip Deformation of Automotive Power Module;2022 IEEE Energy Conversion Congress and Exposition (ECCE);2022-10-09
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